Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.
This report contains market size and forecasts of Wafer Bumping in Global, including the following market information:
Global Wafer Bumping Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Wafer Bumping market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Copper Pillar Bump Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wafer Bumping include ASE Global, Fujitsu, Amkor Technology, MacDermid Alpha Electronics Solutions, Maxell, JCET Group, Unisem Group, Powertech Technology and SFA Semicon, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wafer Bumping companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Bumping Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Wafer Bumping Market Segment Percentages, by Type, 2021 (%)
Copper Pillar Bump
Lead Free Bump
Others
Global Wafer Bumping Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Wafer Bumping Market Segment Percentages, by Application, 2021 (%)
4&6 Inch
8&12 Inch
Global Wafer Bumping Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Wafer Bumping Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Bumping revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Wafer Bumping revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
ASE Global
Fujitsu
Amkor Technology
MacDermid Alpha Electronics Solutions
Maxell
JCET Group
Unisem Group
Powertech Technology
SFA Semicon
Semi-Pac Inc
ChipMOS TECHNOLOGIES
NEPES
TI
International Micro Industries
Raytek Semiconductor
Jiangsu CAS Microelectronics Integration