This report contains market size and forecasts of Press-Pack High Power Semiconductors in global, including the following market information:
Global Press-Pack High Power Semiconductors Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Press-Pack High Power Semiconductors Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Press-Pack High Power Semiconductors companies in 2021 (%)
The global Press-Pack High Power Semiconductors market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Silicon/Germanium Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Press-Pack High Power Semiconductors include Toshiba Electronics Europe GmbH, IXYS, Infineon Technologies AG, Dynex Technologies, Hitachi Energy, Littelfuse, Inc., POWERALIA and Poseico Power Electronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Press-Pack High Power Semiconductors manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Press-Pack High Power Semiconductors Market, by Material, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Press-Pack High Power Semiconductors Market Segment Percentages, by Material, 2021 (%)
Silicon/Germanium
Silicon Carbide (Sic)
Gallium Nitride (Gann)
Global Press-Pack High Power Semiconductors Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Press-Pack High Power Semiconductors Market Segment Percentages, by Application, 2021 (%)
Automotive
Consumer Electronics
IT and Telecommunication
Military and Aerospace
Power Industrial
Others
Global Press-Pack High Power Semiconductors Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Press-Pack High Power Semiconductors Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Press-Pack High Power Semiconductors revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Press-Pack High Power Semiconductors revenues share in global market, 2021 (%)
Key companies Press-Pack High Power Semiconductors sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Press-Pack High Power Semiconductors sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Toshiba Electronics Europe GmbH
IXYS
Infineon Technologies AG
Dynex Technologies
Hitachi Energy
Littelfuse, Inc.
POWERALIA
Poseico Power Electronics