Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.
The global market for Dicing Die Attach Film is estimated to increase from US$ 248.8 million in 2021 to reach US$ 364.6 million by 2028, exhibiting a CAGR of 5.6% during 2022-2028. Keeping in mind the uncertainties of COVID-19 and Russia-Ukraine War, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.
Global main manufacturers of dicing die attach film include Showa Denko Materials, Henkel Adhesives and Nitto, etc. The top three players hold a share about 77%. China Taiwan is the largest market, has a share about 45%, followed by China and North America, with share 19% and 14%, separately.
Report Coverage
This latest report provides a deep insight into the global Dicing Die Attach Film market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, value chain analysis, etc.
This report aims to provide a comprehensive picture of the global Dicing Die Attach Film market, with both quantitative and qualitative data, to help readers understand how the Dicing Die Attach Film market scenario changed across the globe during the pandemic and Russia-Ukraine War.
The base year considered for analyses is 2021, while the market estimates and forecasts are given from 2022 to 2028. The market estimates are provided in terms of revenue in USD millions and volume in K Pcs.
Market Segmentation:
The study segments the Dicing Die Attach Film market and forecasts the market size by Type (Non-Conductive Type and Conductive Type,), by Application (Die to Substrate, Die to Die and Film on Wire,), and region (APAC, Americas, Europe, and Middle East & Africa).
Segmentation by type
Non-Conductive Type
Conductive Type
Segmentation by application
Die to Substrate
Die to Die
Film on Wire
Segmentation by region
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Major companies covered
Showa Denko Materials
Henkel Adhesives
Nitto
LINTEC Corporation
Furukawa
LG
AI Technology
Chapter Introduction
Chapter 1: Scope of Dicing Die Attach Film, Research Methodology, etc.
Chapter 2: Executive Summary, global Dicing Die Attach Film market size (sales and revenue) and CAGR, Dicing Die Attach Film market size by region, by type, by application, historical data from 2017 to 2022, and forecast to 2028.
Chapter 3: Dicing Die Attach Film sales, revenue, average price, global market share, and industry ranking by company, 2017-2022
Chapter 4: Global Dicing Die Attach Film sales and revenue by region and by country. Country specific data and market value analysis for the U.S., Canada, Europe, China, Japan, South Korea, Southeast Asia, India, Latin America and Middle East & Africa.
Chapter 5, 6, 7, 8: Americas, APAC, Europe, Middle East & Africa, sales segment by country, by type, and type.
Chapter 9: Analysis of the current market trends, market forecast, opportunities and economic trends that are affecting the future marketplace
Chapter 10: Manufacturing cost structure analysis
Chapter 11: Sales channel, distributors, and customers
Chapter 12: Global Dicing Die Attach Film market size forecast by region, by country, by type, and application.
Chapter 13: Comprehensive company profiles of the leading players, including Showa Denko Materials, Henkel Adhesives, Nitto, LINTEC Corporation, Furukawa, LG and AI Technology, etc.
Chapter 14: Research Findings and Conclusion