ABF, otherwise known as “Ajinomoto Build-up Film” is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and rigid film that resists expansion and contraction with changes in temperature, making it ideal for use as a substrate between the nanometer-scale and millimeter-scale components of a processor or IC. The AFB substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.
The global market for ABF (Ajinomoto Build-up Film) Substrate is estimated to increase from US$ 4273.5 million in 2021 to reach US$ 6327.9 million by 2028, exhibiting a CAGR of 5.8% during 2022-2028. Keeping in mind the uncertainties of COVID-19 and Russia-Ukraine War, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.
Global key players of ABF (ajinomoto build-up film) substrate include Unimicron, AT&S, Nan Ya PCB, etc. The top three players hold a share about 48%. The global ABF (ajinomoto build-up film) substrates are mainly produced in Japan, South Korea and China Taiwan, they occupied for a share over 75%. Asia-Pacific is the largest market, has a share about 75%, followed by North America and Europe, with share 15% and 8%, separately.
Report Coverage
This latest report provides a deep insight into the global ABF (Ajinomoto Build-up Film) Substrate market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, value chain analysis, etc.
This report aims to provide a comprehensive picture of the global ABF (Ajinomoto Build-up Film) Substrate market, with both quantitative and qualitative data, to help readers understand how the ABF (Ajinomoto Build-up Film) Substrate market scenario changed across the globe during the pandemic and Russia-Ukraine War.
The base year considered for analyses is 2021, while the market estimates and forecasts are given from 2022 to 2028. The market estimates are provided in terms of revenue in USD millions and volume in Sqms.
Market Segmentation:
The study segments the ABF (Ajinomoto Build-up Film) Substrate market and forecasts the market size by Type (4-8 Layers ABF Substrate, 8-16 Layers ABF Substrate and Others), by Application (PCs, Server & Data Center, HPC/AI Chips and Communication), and region (APAC, Americas, Europe, and Middle East & Africa).
Segmentation by type
4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
Others
Segmentation by application
PCs
Server & Data Center
HPC/AI Chips
Communication
Others
Segmentation by region
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Major companies covered
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
NCAP China
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Chapter Introduction
Chapter 1: Scope of ABF (Ajinomoto Build-up Film) Substrate, Research Methodology, etc.
Chapter 2: Executive Summary, global ABF (Ajinomoto Build-up Film) Substrate market size (sales and revenue) and CAGR, ABF (Ajinomoto Build-up Film) Substrate market size by region, by type, by application, historical data from 2017 to 2022, and forecast to 2028.
Chapter 3: ABF (Ajinomoto Build-up Film) Substrate sales, revenue, average price, global market share, and industry ranking by company, 2017-2022
Chapter 4: Global ABF (Ajinomoto Build-up Film) Substrate sales and revenue by region and by country. Country specific data and market value analysis for the U.S., Canada, Europe, China, Japan, South Korea, Southeast Asia, India, Latin America and Middle East & Africa.
Chapter 5, 6, 7, 8: Americas, APAC, Europe, Middle East & Africa, sales segment by country, by type, and type.
Chapter 9: Analysis of the current market trends, market forecast, opportunities and economic trends that are affecting the future marketplace
Chapter 10: Manufacturing cost structure analysis
Chapter 11: Sales channel, distributors, and customers
Chapter 12: Global ABF (Ajinomoto Build-up Film) Substrate market size forecast by region, by country, by type, and application.
Chapter 13: Comprehensive company profiles of the leading players, including Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera and TOPPAN, etc.
Chapter 14: Research Findings and Conclusion